Friday, 05 December 2008 
QUALCOMM Powers World’s First 3G Handsets Based on 65-Nanometer Chipsets PDF Print E-mail
Monday, 18 June 2007

Advanced Process Technology Enables Rich Functionality for Slim and Power-Efficient Devices, Launching Worldwide Now

QUALCOMM Incorporated, a leading developer and innovator of Code Division Multiple Access (CDMA ) and other advanced wireless technologies, today announced a significant milestone in semiconductor process technology as multiple 3G handsets powered by the Company’s 65-nanometer (nm) chipsets began their worldwide commercial launch. At least three handset models are now commercially available and more than 40 additional models are expected to become available this year. The world’s first 3G handsets based on 65 nm chips, these models leverage the 65 nm node of semiconductor manufacturing for cost effectiveness, greater power efficiency and slimmer form factors while supporting the high-speed data capabilities and advanced service opportunities offered by 3G technology.

“QUALCOMM is committed to continually raising the bar for wireless users, delivering richer functionality that is more affordable and offers a better experience,” said Steve Mollenkopf, senior vice president of product management for QUALCOMM CDMA Technologies. “We are pleased to reach this milestone in cutting-edge process technology, together with our customers, and we look forward to enabling additional slim, smart and power-efficient 3G devices for the worldwide market.”

The handset models are based on 65 nm Mobile Station Modem™ (MSM™) chipsets manufactured for QUALCOMM by Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest foundry company.

The 65 nm handset models include:

• The WCDMA  (UMTS ) U120 handset by Huawei
• The WCDMA (UMTS) KU250 handset by LG Electronics
• The HSDPA  U700 handset by Samsung

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