InterDigital SlimChip Modem Platform Selected by Mobile Broadband Module Company
HSPA Baseband IC with Reference Platform Integrated into Leading USB Modems.
InterDigital, Inc. announced its 6071 SlimChip Broadband Modem solution has been selected by a mobile broadband module company. InterDigital's SlimChip baseband IC and reference platform, featuring 2G/3G modes with high performance HSDPA and HSUPA, will be integrated in the customer's leading USB modems and advanced wireless modules that enable high-speed mobile broadband connectivity in laptops and innovative portable devices.
"This design win with a fast-growing customer validates the performance of the SlimChip baseband IC and the flexibility of our pre-certified reference platform," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "In only a few weeks time, our customer was able to turn our baseband chip, supporting software, and reference designs into a leading-edge USB stick form factor prototype capable of reaching industry leading performance on a live network."
InterDigital's family of SlimChip solutions include high performance baseband ICs, broadband modem IP, and complete reference platforms targeting PC cards, PCI-e Mini Cards and USB sticks. These pre-certified SlimChip reference platforms include:
- High performance SlimChip 6071 baseband IC
- 2G/3G protocol stack software with InterRAT
- Reference design with proven RF, power management, connection manager software and middleware drivers
- GCF, PTCRB and IOT testing
- Integration support through carrier approval.
SlimChip products enable companies to accelerate time to market with a proven mobile broadband solution supporting both voice and data in a small and attractive form factor.