www.interdigital.com

HSPA Baseband IC with Reference Platform Integrated into Leading USB Modems.

InterDigital, Inc. announced its 6071 SlimChip Broadband Modem solution has been selected by a mobile broadband module company. InterDigital's SlimChip baseband IC and reference platform, featuring 2G/3G modes with high performance HSDPA and HSUPA, will be integrated in the customer's leading USB modems and advanced wireless modules that enable high-speed mobile broadband connectivity in laptops and innovative portable devices.

"This design win with a fast-growing customer validates the performance of the SlimChip baseband IC and the flexibility of our pre-certified reference platform," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "In only a few weeks time, our customer was able to turn our baseband chip, supporting software, and reference designs into a leading-edge USB stick form factor prototype capable of reaching industry leading performance on a live network."

InterDigital's family of SlimChip solutions include high performance baseband ICs, broadband modem IP, and complete reference platforms targeting PC cards, PCI-e Mini Cards and USB sticks. These pre-certified SlimChip reference platforms include:

• High performance SlimChip 6071 baseband IC
• 2G/3G protocol stack software with InterRAT
• Reference design with proven RF, power management, connection manager software and middleware drivers
• GCF, PTCRB and IOT testing
• Integration support through carrier approval.

SlimChip products enable companies to accelerate time to market with a proven mobile broadband solution supporting both voice and data in a small and attractive form factor.