MobilenniuM Express
3G Industry news from the UMTS
Forum
20 June 2008
InterDigital announced its 6071 SlimChip Broadband Modem solution has been selected by a mobile broadband module company.
According to a new research report from the analyst firm Berg Insight, the number of notebook PCs with HSPA/LTE mobile broadband connectivity in Europe will grow from 8.4 million in 2007 at a compound annual growth rate (CAGR) of 34.1 percent to 49 million in 2013.
Huawei Technologies Co Ltd launched its latest HSPA USB stick, 3G phones and HSDPA gateway at the industry benchmark event CommunicAsia in Singapore. This move signifies Huawei' s continuous efforts in supporting operators to boost their 3G business.
In a bold move to fundamentally advance next-generation broadband wireless base station design, Freescale Semiconductor has introduced the industry's first multi-standard baseband accelerator device.
Sony Ericsson unveils the MD400 and MD400g, the first HSPA USB modems of their kind from Sony Ericsson not only providing high speed broadband but also a combined M2 Memory Stick Micro and a microSD slot brought together in a stylish and attractive design.
Sierra Wireless announced two new additions to the company’s embedded module product line, the MC8790 and MC8790V embedded modules for HSPA networks.
Mobiado continues the tradition of the hardwood Executive Model series with the Professional 105 EM (PRO105EM); and unveils its first gold phone, the Professional 105 GCB (PRO105GCB).
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